Production
    : SMT,Test Line(Component & DDR4/ SSD / M.2 Module)
      for DDR4 Module, Flash Memory Products-SSD, M.2 etc
    : High Power Multi Layer Metal Core PCB (Substrate)
    : Safe & High Speed Charging Battery Pack & BMS Technology(PAT)
    : LED식물등 (천장등, LED Bar, LED3구모듈, 특주제품, 기타 )

 R&D LAB 
    : Plasma Activated Water
    : Smart Farm/Plant Factory Design&Construction
    : 각종 식물에 특성화된 LED식물등 개발
    
 High Power PCB & Substrate         
    : Thick Metal Technology for High Power(High Current & Voltage) 
    : Thick Metal Etching Technology(FR4, Ceramic 등)
    : 0.3~1.0mm 이상 두꺼운 Metal Etching , Patterning 가능 
    : 기타(표면처리 Au, Cu, Ni 등 - 도금 , Sputtering 및 특수표면처리)
 
 
 Safe & Quick Charging Battery Pack / BMS R&D
   (BMS for e-Scooter, Automotive & ESS)
      
                        
 
 Others
    : SMT,COB(Chip On Board)
       : Assembly  및 Semiconductor Packaging 
    : Interconnection Technology(Chip Stack,WireBonding, Flipchip etc)
    : PCB Artwork