2004     2004. 01   회사설립
                                          2004. 02   반도체DDR Memory Module개발 및 생산(DIMM, SoDIMM등)
                                          2004. 09   USB 개발 및 생산
                                                                               
                        2005       2005. 03    Advanced Interconnection Technology(Wirebonding,F/C,Chipstack등)
                                          2005. 06    전자부품소재전문기업 선정(산자부)
                                          2005. 11    벤처기업인증, 연구개발전담부서인정

                        2006      2006. 11   경기유망중소기업 선정

                   2007      2007. 04    INNO-BIZ기업 인증
 
                   2008      2008. 05    경영혁신형중소기업 선정                                  
 
                        2009      2009. 03    Solid State Disk(Drive)개발
 
                        2010      2010. 04     Packaging Thermal Solution for Power IC/TR(Heatsink)
                                     
                          2011       2011. 02    Power LED Lamp개발(고방열PCB/Heatsink)               
 
                        2012     2012. 07    고성능 고용량 USB개발
  
                        2013     2013. 09     RF Sensor무선송/수신기 Low Noise/저전력(Low Power소모)기술개발
 
                          2014        2014. 02    m-SATA개발
 
                        2015     2015. 04     High Power Thermal Solution Technology(반도체,LED,차량용,의료용)
 
                        2016     2016. 06     DDR4 Module/Flash Memory M.2개발 , 기업부설연구소 인정
                                       2016. 11    고방열PCB기술개발(High Power Metal Core PCB)(특허출원)

                        2017     2017. 09    반도체 F/C Metal Lid Package용 Power PCB Substrate개발
         
                   2018      2018. 01    2차전지 안전.고속충전(BMS)기술개발(PAT.특허:한,미,일,중)
                                          2018. 07    Power PCB제조방법및이에의해생성된인쇄회로기판(특허출원)

                        2019      2019. 05    Smart Farm/식물공장용 LED식물등개발
                                           2019. 06    고방열PCB제조방법 및 이에의해 제조된 고방열PCB(특허출원)

                        2020      2020. 08     Power Laser Diode 용 고방열PCB/Substrate개발